Description
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Product Details
- Edition:
- 1.0
- Published:
- 03/05/2015
- Number of Pages:
- 21
- File Size:
- 1 file , 420 KB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
